Group Capability
 
Min Cost
L-1 Production
L-2 Production
L-3 Production
  Thou um Thou um Thou um Thou um
Inner Layer Tracking
Min track/gap 7/6 175/150 4/4 100/100 3/4 75/100 3/3 75/75
Min land for tangency 7 175 6 150 5 125 4 100
Outer Layer Tracking
Min track/gap 7/6 175/150 5/5 125/125 4/5 100/125 4/4 100/100
Min land for tangency 6 150 5 125 4 100 3 75
Max hole diameter to tent 5mm 5mm 5mm 5mm
PTH Boards
Material Di-functional FR4 Multi- functional High Tg FR4 Polyimide Glass BT Epoxy Ask for details polyimide-Aramid Cyanate-Ester / Glass PPO / PPE Ask for details PTFE
Min board thickness 1.6mm 0.8mm 0.5mm < 0.5mm
Max board thickness 1.6mm 3.2mm 5.0mm > 5.0mm
Base material tolerance +/- 13% +/- 13% +/- 10% +/- 7%
Multilayer Boards
Material Di-functional FR4 Multi-functional High Tg FR4 Polyimide Glass - BT Epoxy Heatsink

Heavy copper > 2oz Copper Invar - Copper Cyanate Ester / Glass Polyimide-Aramind PP0/PPE Heatsink

 Carbon - Molybdenum - PTFE Composites
Number of layers 4 > 4 to 18 > 18 to 42 > 42
Min board thickness 1mm 0.8mm 0.4mm 0.3mm
Max board thickness 1.6mm 3.2mm 5mm > 5mm
Base material tolerance +/- 13% +/- 10% +/- 8% < +/- 8%
Bow and twist
Bow and twist 1% 0.7% 0.5% < 0.5%
Holes
Minimum drilled hole 0.40mm 0.35mm 0.20 - 0.30mm < 0.2mm
NPTH Hole size tolerance +/- 0.05mm +/- 0.05mm +/- 0.025 +/- 0.025mm
PTH hole size tolerance +/- 0.075mm +/- 0.075 +/- 0.05mm +/- 0.0375mm
Positional tolerance +/- 0.1mm +/- 0.075mm +/- 0.05mm +/- 0.045mm
2nd drill positional tolerance +/- 0.15mm +/- 0.15mm +/- 0.125mm +/- 0.10mm
Plating
Through holes        
Minimum copper in hole 20um 20um other than 20um other than 20um
Average copper in hole 25um 25um other than 25um other than 25um
Blind and buried vias        
Minimum copper in hole 20um 20um other than 20um other than 20um
Average copper in hole 25um 25um other than 25um other than 25um
Aspect ratio </= 4:1 > 4:1 to 6:1 > 6:1 to 10:1 > 10:1
LPISM
Minimum dam 5 125 3 75 2 50 2 50
Minimum aperture 4 100 2.5 62.5 1.5 37 1 25
Solder mask coverage IPC-SM-840C 500V Breakdown Voltage
Gold
Immersion Gold        
Nickel thickness 3 - 6um 3 - 6um 3 - 6um 3 - 6um
Gold 0.05 - 0.1um 0.05 - 0.1um 0.05 - 0.1um 0.05 - 0.1um
Electrolytic Gold (tab finger)        
Minimum nickel 2.5um 2.5 - 5um > 5um > 5um
Minimum gold 2.5um 2.5um 1.25 - 2.5um 1.25 - 2.5um
HASL (vertical process)
Thickness 2 - 50um 2 - 50um 5 - 15um  
Notation
Minimum line width 12 300 10 250 6 150 5 125
Minimum gap (notation to copper) 12 300 10 250 8 200 < 8 < 200
Colour white/yellow white/yellow/black combination any
Peelable resist
Minimum resist coverage 14 350 12 300 10 250 8 200
Minimum gap (resist to copper) 12 300 12 300 10 250 8 200
Minimum resist width 4mm 3mm 2mm 1mm
Maximum hole size to tent 2.0mm 2.5mm 3.0mm 3.5mm
Colour green/blue/trans blue green/blue/trans blue green/blue/trans blue white
SSVia plug
Maximum drilled hole size 0.45mm 0.7mm 1.0mm > 1mm
Rout
Hole to edge tolerance +/- 0.2mm +/- 0.13mm +/- 0.1mm +/- 0.08mm
Minimum diameter cutter 2.4mm 1mm 0.7mm 0.7mm
Score
Hole to score +/- 0.2mm +/- 0.15mm +/- 0.1mm +/- 0.05mm
Score to score +/- 0.2mm +/- 0.15mm +/- 0.1mm +/- 0.05mm
Minimum web thickness (1.6mm) 0.5mm 0.4mm 0.35mm < 0.35mm
Web thickness tolerance +/- 0.1mm +/- 0.05mm +/- 0.05mm +/- 0.05mm
Immersion tin
Tin thickness 1um 1um Max 1.2um > 1.2um
Silver (sterling)
Silver thickness 0.2um 0.2um 0.2um 0.2um
Electrical test
Minimum SMD pitch 25 625 20 500 14 350 < 12 <300
Minimum uBGA pitch 40 1000 32 800 20 500 16 400
Maximum circuit size (fixtured) 528mm x 406mm 528mm x 406mm 528mm x 406mm 528mm x 406mm
Maximum circuit size (fixtureless) 914mm x 609mm 914mm x 609mm 914mm x 609mm 914mm x 609mm
Minimum SMD pitch (fixtureless) 10 250 10 250 8 200 < 8 < 200

 

 
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