Telford

Telford is a flexible facility which specialises in the delivery of standard technology PCBs.

We are geared for low to medium, high-mix batch output for more than 300 customers.

In addition to our diverse customer base, Invotec Telford offers strategic support to our sister facilities

 

Capability
  • High mix, small batch specialist facility
  • Supports a wide range and diverse customer base
  • Provides excellent NPI through low and medium volumes
  • D/S through 10 layer + capability of technologies
  • Provides strategic support to Tamworth and Blackburn
summary technology roadmap units current production capability current prototype planned production capability planned prototype
GENERAL
lead time availability days 5 - 30 3 - 20 5- 20 2 - 10

 

summary technology roadmap units

current production capability

 current prototype planned production capability planned prototype
BUILD / CONSTRUCTION
materials (type - FR4, CEM3 etc) text
FR4 BT Polyimide
Tg (glass transition temp) max C 260 280 260 280
dielectric constant (at 1MHz) value < 5.4 < 5.4 < 5.4 < 5.4
loss tangent (@MHz) value < 0.035 < 0.035 < 0.035 < 0.035
min specified prepreg thickness µm 50 50 50 50
max inner-layer prepreg thickness µm 700 700 700 700
blind and buried vias (Y/N) N N N N
microvia (laser) (Y/N) N N N N

 

summary technology roadmap units current production capability current prototype planned production capability planned prototype
PADS AND HOLES
through hole size (FHS) µm 300 250 300 250
blind/buried hole size (DHS) µm N/A N/A N/A N/A
plated through hole size tolerance (+/-) µm 75 50 75 50
non plated hole size tolerance (+/-) µm 50 25 50 25
hole positional tolerance µm 75 50 75 50
through hole pad size (inner) (assume tangency) µm DHS + 250 DHS + 200 DHS +250 DHS + 200
through hole pad size (outer) (assume tangency) µm DHS + 250 DHS + 200 DHS + 250 DHS + 200
blind/buried pad size µm N/A N/A N/A N/A
press fit hole tolerance (+/-) µm 75 50 75 50

 

summary technology roadmap units current production capability current prototype planned production capability planned prototype
MISCELLANEOUS
design text N N N N
buried capacitance TM (Y/N) N N N N
embedded coaxial technology (patent pending) (Y/N) N N N N
embedded resistance (Y/N) N N N N
bellcore compliance (Y/N) N N N N
heatsink (internal) (Y/N) N N N N
heatsink (external) (Y/N) N N N N

 

summary technology roadmap units current production capability current prototype planned production capability planned prototype
PRODUCT DIMENSIONS
max PCB delivery unit (testable) mm 575 x 424 575 x 424 575 x 424 575 x 424
min PCB thickness mm 0.8 0.5 0.8 0.5
max PCB thickness mm 3.2 3.2 3.2 3.2
PCB thickness tolerance % 10 10 10 10
broad flatness (%) % 1 1 1 1
max layer count value 24 24 24 24
aspect ratio (0.3mm hole 20um min CU) ratio 6:1 6:1 8:1 6:1

 

summary technology roadmap units current production capability current prototype planned production capability planned prototype
INNERLAYERS
minimum track width & spacing ['pitch'/2] µm 125 125 125 125
Cu foil thickness (min) µm 17 12 17 12
Cu foil thickness (max) µm 105 105 105 105 >
cores with imbalanced Copper (Y/N) Y Y Y Y
min dielectric thickness [cores] µm 200 200 200 200
track width tolerance (+/-) [with < 1oz base foil] µm 50 50 50 50

 

summary technology roadmap units current production capability current prototype planned production capability planned prototype
MICROVIA
microvias 1 to 2 & n to [n - 1] (Y/N) N/A N/A N/A N/A
min microvia hole size (drilled) µm N/A N/A N/A N/A
min microvia pad size capture (outer) µm N/A N/A N/A N/A
min microvia pad size bounce (inner) µm N/A N/A N/A N/A
microvia: 1 to 3 and N to [n-2] (Y/N) N/A N/A N/A N/A
microvia with buried vias layer 2 to [n-1] (Y/N) N/A N/A N/A N/A
microvia: sequential build up (Y/N) N/A N/A N/A N/A
microvia: filling of vias (plated Cu) (Y?N) N/A N/A N/A N/A

 

summary technology roadmap units current production capability current prototype planned production capability planned prototype
OUTERLAYER
min track width & gap T/G µm 125 125 125 125
Cu foil thickness (min) µm 17 12 17 12
Cu foil thickness (max) µm 105 105 105 105
track width tolerance µm 50 50 50 50

 

summary technology roadmap units current production capability current prototype planned production capability planned prototype
SOLDERMASK
type text Pr65AF Various Pr65HF Various
min clearance to copper (design) µm 100 100 100 100
min solder dam µm 100 75 100 75
min breakdown voltage V 500 > 500 500 > 500
min hardness (pencil hardness) H 6H 6H 6H 6H
LDI soldermask capability (Y/N) N N N N

 

summary technology roadmap units current production capability current prototype planned production capability planned prototype
SURFACE FINISH
Electroplated Ni/Au (Y/N) Y Y Y Y
Ni thickness (min) µm 2.5 2.5 2.5 2.5
Ni thickness (max) µm 5 5 5 5
Au thickness (min) µm 1 1 1 1
Au thickness (max) µm 5 5 5 5
Immersion silver (Y/N) Y Y Y Y
Immersion tin (Y/N) Y Y Y Y
OSP (Y/N) Y selective Y selective Y selective Y selective
Pb-free HASL (Y/N) Y Y Y Y

 

summary technology roadmap units current production capability current prototype planned production capability planned prototype
SURFACE FINISH
HASL (min thickness) measure on crest of 0.5 QFP pad µm 2 5 2 5
HASL (max thickness) µm 50 15 50 15
SnPB reflow (Y/N) Y Y Y Y
Electroless Ni/immersion Au (Y/N) Y Y Y Y
Ni thickness (min) µm 4 4 4 4
Ni thickness (max) µm 7 7 7 7
Au thickness (min) (Y/N) 0.05 0.05 0.05 0.05
Au thickness (max) (Y/N) 0.1 0.1 0.1 0.1

 

summary technology roadmap units current production capability current prototype planned production capability planned prototype
SCREEN PRINT
peelable mask (Y/N) Y Y Y Y
carbon (Y/N) Y Y Y Y
via plugging (Y/N) Y Y Y Y
notation (legend) (Y/N) Y Y Y Y
notation - min line width µm 125 100 125 100
screen print notation registration capability (+/-) µm 100 75 100 75

 

summary technology roadmap units current production capability current prototype planned production capability planned prototype
PROFILE
rout min hole to edge (+/-) µm 150 100 150 100
scoring (V cut) location tolerance (+/-) µm 150 150 150 150
scoring (V cut) web thickness (1.6mm PCB) µm 500 500 500 500
scoring (V cut) web thickness tolerance (+/-) µm 100 100 100 100

 

summary technology roadmap units

current production capability

 current prototype planned production capability planned prototype
ELECTRICAL TEST
test voltage v 25 - 250 25 - 250 25 - 250 25 - 250
insulation requirements for shorts (max) M 300 300 300 300
resistance for opens (mins)

?

 2 2 2 2
min pitch device (QFP)

µm

 300 250 300 250
min pitch device (array package) µm 300 250 300 250
max pad density text flying probe flying probe flying probe flying probe
absolute impedance (most difficult)

?

 TBA TBA TBA TBA
min impedance tolerance          
single % TBA TBA TBA TBA
differential % TBA TBA TBA TBA

 
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