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Typical PCB Specification



    Notes
No. of layers 8  
Material FR4  
Finished thickness 1.6mm see Note 1
Board type PTH  
Cu Weight (oz) outers 1  
Cu Weight (oz) inners 0.5  
Plating thickness (micron) 20  
Circuit length 174.6mm  
Circuit width 106.7mm  

 

Total No. holes 2256  
Largest hole (finished) 3.5mm  
Smallest hole (finished) 0.3mm  
No. of hole sizes 11  

 

Solder resist (side 1,2,both) BOTH  
Solder resist type LPISM  
Solder resist colour GREEN  
Peelable solder resist YES  

 

Legend (side 1,2,both,none) BOTH  
Legend colour WHITE  
Batch/date code required YES see note 2
Finish Imm gold  
Gold edge connectors YES  
Thickness required 5/1.5 see note 3
Number of fingers 116  
Finger size 1x6mm  

 

Min track/gap (outers) 0.15/0.15  
Min track/gap (inners) 0.12/0.12  
SMD pads (side 1) 1663  
SMD pads (side 2) 1150  
Minimum pitch 0.5mm  
Minimum annular ring 0.15  

 

Controlled impedance YES see note 4
Via plugging required NO  
Chamfer YES see note 5
Electrical test required YES  
Approval UL  

Additional information

Chamfer information is included on drill drawing.

All Gerbers are 274x, drill file is Excellon, Netlist is IPC-D-356

Note 1 +/-0.2mm measured over copper

Note 2 May appear on outer copper layer if preferred

Note 3 Nickel/Gold in micron

Note 4 Layer 1

Note 5 Gold edge connector must be bevelled to PCI specification

 

Engineering information

Engineering Solutions

Align the customer design requirements to the correct interconnect solution, taking into consideration cost, manufacturing complexity and working environment.

  • PCB expertise to support increasing technology.
  • High Density Interconnect (HDI).
                - Microvia.
                - Sequential lamination.
                - Depth drilling.
                - Composite builds.
                - Complex Flexi / Rigid.
  • Commitment to a “Design for Manufacture” process.
  • Close linkage with customer engineers.
                - Design rule checks and reports.
  • Active participation with the customer at the Design Concept Stage.
                - DFM training.
                - Engineering Manual.
                - On-site training experience with advanced substrates.
                - In-depth experience with advanced substrates.
                - Cost reduction proposals.

Drill Information

Accepted Formats :
  • Excellon File (Format 1 or 2)
  • Gerber
  • Sieb and Meyer

The files supplied should contain X Y co-ordinates of all the relevant tools separately defined. If tools of equal size exist in the program (ie 2.00mm (.079") plated, 2.00mm (.079") non-plated) they should be separated in the file with unique tool numbers. Hole sizes stated should be finished hole requirements.

The drill information should also be accompanied by a drill drawing (or identifier). This should contain a graphic representation of the drill positions (ie each tool size depicted as a letter or symbol) along with information on hole tolerance (positional and dimensional) and classification (ie plated or non-plated). This information ensures efficient, accurate generation of drill programs and provides a valuable tool for inspecting the finished boards to ensure customer requirements are met.

Digital Artwork Files

Accepted Formats :

 
  • Gerber RS274X
  • ODB ++ Only through the Valor (Enterprise) verification Tool
  • Orbotech Backup Format
  • MDA
  • GC CAM
  • Gerber RS274D (+ Aperture List )
All artwork layers should be supplied as separate CAD files, for example :
  • Copper Layers
  • Solder Mask
  • Legend
  • Peelable Resist
  • Carbon Ink

ARRAYS -Any PCB's required in an array layout by the customer should be supplied in an array format. This should include array dimensions, internal step and repeats, array border tooling including fiducials and should appear on every layer of the CAD data.

MERGE LAYERS - The use of merge data (i.e. combining of design files to produce one working layer) should be avoided. This is because problems arise with 'sliver' conditions, substitution of drawn pads, and the general testability of the design (in particular with regards to 'negative' layers

Fabrication Drawings

Accepted Formats :
  • HPGL
  • Gerber
  • Post Script
  • Any Windows Supported Drawing
    (JPEG, PDF, .DFX, .DWG, TIFF etc)
  • Customer Original Drawings
When possible, the drawings should be included in the data package. The advantages of drawings supplied as electronic files are:
  • Legibility
  • Accuracy
  • Easily scaled
  • Eliminates delays
  • Storage of data is more efficient if whole kit is in the same format
The fabrication drawing should contain all the necessary information to be able to manufacture the PCB (see the fabrication notes below for an example). This information only needs to be included as part of the fabrication drawing if a separate PCB specification is not being produced. The fabrication information will generally contain information such as:
  • Layer names and build-up order
  • Board thickness
  • Finish required
  • Any special instructions
  • Issue level information of artwork supplied
  • Copper thickness
  • Tolerances on holes and board profile clearly defined

If the PCBs are to be supplied in a frame or as part of an array then the array layout must be specified on the drawing. The array size and array datum to board datum must be specified. The step and repeat of any boards within the array must be dimensioned. If there are any 'break-out' features then these must be defined geometrically and their positions clearly indicated.

The fabrication drawing must contain all the necessary dimensions to be able to produce the board profile. This will probably be done by most designers if the finished item is a single board. However, if the finished item is an array or a single board with a very complex profile then it may be desirable or simply good drawing practice to produce a separate profile drawing to avoid high density information on one drawing. It is also helpful if this profile drawing is sent as an actual artwork layer as well.

Profile Drawings

The single board drawing, whether part of the fabrication drawing or separate, should contain all the necessary dimensions to produce the required board geometry. This should include the board length and width, edge cuts dimensioned (position and size), critical tooling holes, internal radii (rout cannot produce right angled corners), and hole to edge or datum point. One hole in the drill layer must be dimensioned to the PCB edges to locate circuitry accurately on the products.

The outline file must be a representation of the true board edge (uncompensated). Providing this information graphically has two major benefits:

  • Assists Design-For-Manufacture checks which use the profile as reference points.
  • Reduces the lead time on program generation by using graphic comparisons.

Digital aperture information

Accepted Formats

  • Read Me
  • ASCII Text File

When standard Gerber files are supplied for design layers, it is essential that a relevant 'aperture list' accompanies the data. The aperture list should be in electronic format to ensure automatic input can be utilised (aperture lists supplied as hard copy printouts must be typed manually into the system, which can introduce human error).

The requirements of a good aperture list are that the format remains consistent and that it contains information on D-codes, shapes and sizes defined in separate fields. If complex shapes are used in the design, then a fully dimensioned drawing is required to ensure accurate reconstruction of the feature on the resulting artworks.

Typical well defined aperture list

 

D-Code Shape X-size Y-size Aux size Rotation
10 round 20 0 0 0
11 round 12 0 0 0
12 ring 50 15 0 0
13 ring 118 39 0 0
35 square 40 0 0 0
36 square 50 0 0 0
252 diamond 55 0 0 0
336 rectangle 44 90 0 90
339 rectangle 52 98 0 0
340 thermal 96 70 12 90
341 thermal 88 60 12 45
342 box 120 55 5 0

 

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